Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/39499
Title: การหาสภาวะที่เหมาะสมที่สุดในกระบวนการขัดขอบนอกแผ่นแก้วสำหรับผลิตภัณฑ์ฮาร์ดดิสก์
Other Titles: Optimization of Outer Edge Glass Polishing Process for Hard Disk Product
Authors: เสน่ห์ ยาวิชัย
Authors: ผู้ช่วยศาสตราจารย์ ดร.สรรฐติชัย ชีวสุทธิศิลป์
เสน่ห์ ยาวิชัย
Issue Date: Mar-2015
Publisher: เชียงใหม่ : บัณฑิตวิทยาลัย มหาวิทยาลัยเชียงใหม่
Abstract: The objective of this study was to find the optimum process in order to polish an outer edge glass for a hard disk product. A company found that here was a problem about the productivity which was down 30.7% after changes substrate thickness and up outer edge stock removal. As a result it was late to deliver the products to customer; because daily output is not what the producer is expecting. The researcher has been trying to increase more productivity of outer edge polishing process by using Design of Experiment technique. From studying the outer edge polishing process, the researcher learns from a machine's guide book and references. Thus, picking 7 factors to create factional factorial design 2IV7-3. And, the factors of outer edge removal parameter are A, B and D. The factors of defective are A, B, C, D, F and G. Furthermore, the factors of outer edge physical characteristics are A and F. But, the result of outer polishing rate is less than the target. So, the researcher brings factors A, B and D to test by steepest accent technique which is the highest climbing to find an appropriate factor for creating factional factorial design 2IV6-2 again for find optimal condition of Outer Edge polishing process. Finally, after using the right sources, the result of productivity was increased by 36.9% before the development plan was created. It helps the outer edge polishing run smoothly and strict to the plan. Manufacturer can control goods to customer on time.
URI: http://repository.cmu.ac.th/handle/6653943832/39499
Appears in Collections:ENG: Independent Study (IS)

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