Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/76390
Title: Bond strengths of three-step etch-and-rinse adhesives to silane contaminated dentin
Authors: Vasavat Soontornvatin
Taweesak Prasansuttiporn
Ornnicha Thanatvarakorn
Sumna Jittidecharaks
Keiichi Hosaka
Richard M. Foxton
Masatoshi Nakajima
Authors: Vasavat Soontornvatin
Taweesak Prasansuttiporn
Ornnicha Thanatvarakorn
Sumna Jittidecharaks
Keiichi Hosaka
Richard M. Foxton
Masatoshi Nakajima
Keywords: Dentistry;Materials Science
Issue Date: 1-Jan-2021
Abstract: This study aimed to evaluate the effect of silane coupling agent contamination on the microtensile bond strength (μTBS) of 3-step etch-and-rinse adhesives on dentin. Flat occlusal dentin surfaces were prepared and randomly divided into 8 groups (n=20) based on the tested adhesives; Scotchbond Multi-purpose or Optibond FL, with contamination of an experimental silane (2 vol% of 3-m ethacryloxypropyltrimethoxysilane at pH 4.5) before acid-etching, after-etching or after-priming; while the groups without silane contamination served as controls. μTBS data were analyzed by two-way ANOVA and Tukey’s HSD tests at a significance level of 0.05. Additional specimens of contaminated dentin were used to analyze changes in the organic molecules by Fourier transform infrared spectroscopy (FTIR). Silane contamination before acid-etching did not significantly change μTBS (p>0.05), but contamination afteretching and after-priming significantly decreased ^TBS of both adhesives (p<0.05). Silane contamination had an adverse effect on the dentin bond strength of 3-step etch-and-rinse adhesives especially after-priming.
URI: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85103682127&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/76390
ISSN: 18811361
02874547
Appears in Collections:CMUL: Journal Articles

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