Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/72679
Title: The effects of initial rejuvenation on the cold joining behavior of Cu<inf>60</inf>Zr<inf>40</inf> metallic glass
Authors: Dmitry Olegovich Bokov
Wanich Suksatan
Gunawan Widjaja
Ahmad Khoiri
Mustafa Z. Mahmoud
Zuhair I. Al Mashhadani
Abdullah Hasan Jabbar
Supat Chupradit
Hashim Abbas
Mustafa M. Kadhim
Aravindhan Surendar
Yasser Fakri Mustafa
Authors: Dmitry Olegovich Bokov
Wanich Suksatan
Gunawan Widjaja
Ahmad Khoiri
Mustafa Z. Mahmoud
Zuhair I. Al Mashhadani
Abdullah Hasan Jabbar
Supat Chupradit
Hashim Abbas
Mustafa M. Kadhim
Aravindhan Surendar
Yasser Fakri Mustafa
Keywords: Chemistry;Materials Science
Issue Date: 1-May-2022
Abstract: In this work, the cold joining of Cu60Zr40 metallic glass (MG) was performed by the molecular dynamics (MD) simulation, and the effects of temperature (200–600 K) and joining velocity (6–18 m/s) on the plasticity and mechanical properties of the joint zone were evaluated. Moreover, an initial rejuvenation process was carried out to manipulate the atomic structure of MG to find the role of structural variations on the joining performance. The results indicated that the increase of velocity led to the sharp decline of ultimate strength in the raw-MG joints, while the rejuvenated MG experienced a slight decrease of strength under the rise of velocity. This was due to the fact that the presence of a more defective structure in the rejuvenated sample inhibited the accumulation of local strained regions at the interface in higher velocities. On the other side, the rejuvenated sample was more sensitive to the increase in bonding temperature. At the higher temperatures (500–600 K), the more softening events appeared in the rejuvenated structure, leading to extreme convexity and misalignment in the assemblies. As a result, the strength and plasticity sharply deteriorated in the high temperatures. Finally, it is concluded that the rejuvenated sample is more reliable in the joining process with high velocity; however, it is very sensitive to the bonding temperature.
URI: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85129135603&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/72679
ISSN: 14320630
09478396
Appears in Collections:CMUL: Journal Articles

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