Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/60197
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dc.contributor.authorPhatthamon Kiattisaksophonen_US
dc.contributor.authorSukdiphon Thiansemen_US
dc.date.accessioned2018-09-10T03:39:13Z-
dc.date.available2018-09-10T03:39:13Z-
dc.date.issued2008-01-01en_US
dc.identifier.issn01252526en_US
dc.identifier.other2-s2.0-67650333138en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=67650333138&origin=inwarden_US
dc.identifier.urihttp://cmuir.cmu.ac.th/jspui/handle/6653943832/60197-
dc.description.abstractIn this study aims to prepare cordierite-mullite composite to be use as a thermal shock resistance materials. Commercial available cordierite and mullite powders were used as starting raw materials with various ratios up to 100 wt% and were mixed together by ball milling in order to prepare a composite material. 0.6 wt% polyvinyl alcohol (PVA) was also added in the mixtures. The specimen was pressed under 1,500 kg/cm2 and sintered between 1250°C and 1400°C with a temperature interval of 50°C. The thermal expansion coefficient was measured and observed by loop of thermal behavior when heated up to maximum temperature and cooled down to room temperature. Thermal behavior was studied. Thermal shock resistance was measured following ASTM method. The microstructure of composite has been characterized by scanning electron microscope (SEM). The result revealed that the percentage of cordierite-mullite at 70:30 wt% and sintered at 1400 °C showed good results in both of physical and thermal properties.en_US
dc.subjectBiochemistry, Genetics and Molecular Biologyen_US
dc.subjectChemistryen_US
dc.subjectMaterials Scienceen_US
dc.subjectMathematicsen_US
dc.subjectPhysics and Astronomyen_US
dc.titleThe preparation of cordierite-mullite composite for thermal shock resistance materialen_US
dc.typeJournalen_US
article.title.sourcetitleChiang Mai Journal of Scienceen_US
article.volume35en_US
article.stream.affiliationsChiang Mai Universityen_US
Appears in Collections:CMUL: Journal Articles

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