Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/55425
Title: Low-energy plasma immersion ion implantation modification of bacteria to enhance hydrolysis of biomass materials
Authors: K. Sangwijit
J. Jitonnom
S. Pitakrattananukool
L. D. Yu
S. Anuntalabhochai
Authors: K. Sangwijit
J. Jitonnom
S. Pitakrattananukool
L. D. Yu
S. Anuntalabhochai
Keywords: Chemistry;Materials Science;Physics and Astronomy
Issue Date: 25-Nov-2016
Abstract: © 2016 Elsevier B.V. This report is on exploring low-energy plasma immersion ion implantation (PIII) as a novel bio-technique and an improved alternative to ion beams to induce bacterial mutation for enhancing the hydrolysis of biomass materials, eventually benefiting environmental protection and biofuel production. Cellulase-producing bacterial cells of Bacillus amyloliquefaciens were treated by argon or nitrogen PIII at a bias voltage of − 2.5 kV with various fluences from 1 × 1015to 1 × 1017 ions/cm2to induce mutation. The bacterial mutants exhibiting clear potentiality of enhanced cellulase activity which indicated improved hydrolysis capability were screened. Comparisons in the cellulase activity between the wild type as the control and the mutant under various buffer pH values and temperatures showed that the cellulase activities of the mutant were clearly higher than that of the control, particularly for neutral pH and lower and higher temperatures. The cellulase hydrolysis ability tests against various biomass materials including rice straw, corn stover and corn husk demonstrated the mutant possessing the higher hydrolysis activity, particularly for the corn husk. Physical and biological mechanisms involved in the bacterial cell modification induced by the low-energy PIII were investigated and discussed in terms of the ion stopping in the specific bacterial cell envelope and the modification of the DNA sequence.
URI: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84994300052&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/55425
ISSN: 02578972
Appears in Collections:CMUL: Journal Articles

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